Mfr. Part
TLG1180BCA
Manufacturer
TELEGEN. Y-IC is a quality distributor of the TELEGEN brand and we will provide customers with the best products and services.
Detailed Description
The TLG1180BCA is a specialized integrated circuit (IC) designed for hot applications. It features advanced thermal management capabilities and is packaged in a compact BGA (Ball Grid Array) enclosure.
Key Features
Optimized for high-temperature environments
Efficient heat dissipation through BGA packaging
Reliable and robust performance
Compact and space-saving design
Key Advantages
Maintains optimal operation in hot conditions
Improves system reliability and longevity
Enables compact and thermally efficient system designs
Trusted TELEGEN brand quality
Packaging
BGA (Ball Grid Array) enclosure
Compact and space-saving design
Optimized for thermal management
Lifecycle
The TLG1180BCA is an active product and not nearing discontinuation. There are currently no equivalent or alternative models available. Please contact our sales team via our website for more information.
Key Application Areas
Industrial automation
Automotive electronics
Power electronics
Aerospace and defense systems
Datasheet
The most authoritative datasheet for the TLG1180BCA is available on our website. Customers are recommended to download it for detailed technical specifications and performance data.
Request for Quotation Now
Customers are recommended to obtain quotes on our website. Get a quote, learn more, or take advantage of this limited-time offer.
