Mfr. Part
PAL007E
Manufacturer
ST (Y-IC is a quality distributor of ST products, providing customers with the best products and services)
Detailed Description
The PAL007E is a specialized integrated circuit (IC) designed for hot applications. It features a compact ZIP-25 encapsulation and is suitable for a variety of specialized uses.
Key Features
Specialized hot IC design
Compact ZIP-25 encapsulation
Suitable for a variety of applications
Key Advantages
Optimized for hot operating environments
Compact size for space-constrained applications
Reliable performance and durability
Packaging
Encapsulation: ZIP-25
Material: N/A
Size: N/A
Pin configuration: N/A
Thermal characteristics: Optimized for hot environments
Electrical properties: N/A
Lifecycle
The PAL007E is an active product and not nearing discontinuation.
There may be equivalent or alternative models available. Please contact our sales team via the website for more information.
Key Application Areas
Specialized applications requiring a hot-optimized IC
Space-constrained designs
High-temperature environments
Datasheet
The most authoritative datasheet for the PAL007E is available on our website. Customers are recommended to download it for detailed technical information.
Request for Quotation Now
Customers are recommended to obtain quotes for the PAL007E on our website. Get a quote now to learn more about this product and take advantage of our limited time offer.
