Mfr. Part
R2A60167BGW0
Manufacturer
RENESAS - Y-IC is a quality distributor of RENESAS products, providing customers with the best products and services.
Detailed Description
The R2A60167BGW0 is a specialized integrated circuit (IC) from RENESAS designed for hot applications.
Key Features
BGA encapsulation
Optimized for high-temperature environments
Key Advantages
Reliable performance in hot conditions
Compact and efficient design
Packaging
BGA (Ball Grid Array) package
Suitable for high-temperature applications
Robust electrical and thermal characteristics
Lifecycle
The R2A60167BGW0 is an active product. Equivalent or alternative models are available. Customers are advised to contact our sales team via the website for more information.
Key Application Areas
Industrial equipment
Automotive electronics
High-temperature consumer devices
Datasheet
The most authoritative datasheet for the R2A60167BGW0 is available on our website. Customers are recommended to download it.
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