Mfr. Part
K7Q161862B-EC16
Manufacturer
SAMSUNG
Y-IC is a quality distributor of SAMSUNG brand products and will provide customers with the best products and services.
Detailed Description
The K7Q161862B-EC16 is a specialized hot integrated circuit (IC) from SAMSUNG. It features a BGA (Ball Grid Array) encapsulation.
Key Features
BGA encapsulation
Specialized hot IC
Key Advantages
Reliable and high-quality SAMSUNG brand product
Distributed by Y-IC, a trusted quality distributor
Packaging
BGA (Ball Grid Array) encapsulation
Detailed packaging information available on the datasheet
Lifecycle
The current product model is not nearing discontinuation
Equivalent or alternative models may be available, customers are advised to contact the Y-IC sales team for more information
Key Application Areas
Specialized applications requiring hot integrated circuits
Datasheet
The most authoritative datasheet for the K7Q161862B-EC16 is available on the Y-IC website. Customers are recommended to download the datasheet for detailed technical specifications.
Request for Quotation Now
Customers are recommended to obtain quotes for the K7Q161862B-EC16 on the Y-IC website. Get a quote, learn more, or take advantage of our limited-time offer.
