Mfr. Part
K7B401825B-QC75
Manufacturer
SAMSUNG
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Detailed Description
The K7B401825B-QC75 is a specialized integrated circuit (IC) designed for hot applications.
Key Features
Optimized for high-temperature operations
Compact LQFP package design
Robust and reliable performance
Key Advantages
Enhanced thermal management capabilities
Space-saving footprint
Trusted SAMSUNG quality and reliability
Packaging
Package Type: LQFP (Low-Profile Quad Flat Package)
Package Material: Plastic
Pin Configuration: 100 pins
Thermal Characteristics: Optimized for high-temperature environments
Electrical Properties: Suitable for specialized hot applications
Lifecycle
This product is an active and in-production model.
There are no direct equivalent or alternative models available at this time.
For the latest information or to inquire about availability, please contact our sales team via the website.
Key Application Areas
Industrial automation
Automotive electronics
Aerospace and defense systems
High-temperature electronics
Datasheet
The most authoritative datasheet for the K7B401825B-QC75 is available on our website. Customers are recommended to download it for detailed technical specifications and performance information.
Request for Quotation Now
Customers are recommended to obtain quotes for the K7B401825B-QC75 on our website. Get a quote now to learn more about this specialized hot IC from SAMSUNG.
