ZSSC3170EE2R
IDT, Integrated Device Technology Inc
Deutsch
Artikelnummer: | ZSSC3170EE2R |
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Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
Teil der Beschreibung.: | IC INTFACE SPECIALIZED SGNL COND |
Datenblätte: |
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RoHs Status: | Lead free / RoHs compliant |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Anzahl | Einzelpreis |
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2000+ | $3.63 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
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Spannungsversorgung | 4.75V ~ 5.25V |
Supplier Device-Gehäuse | 20-SSOP |
Serie | Automotive, AEC-Q100 |
Verpackung / Gehäuse | 20-SSOP (0.209", 5.30mm Width) |
Paket | Tape & Reel (TR) |
Produkteigenschaften | Eigenschaften |
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Befestigungsart | Surface Mount |
Schnittstelle | I²C, LIN, PWM, ZACwire™ One-Wire Interface |
Grundproduktnummer | ZSSC3170 |
Anwendungen | Sensor Signal Conditioner - Resistive |
ZSSC3170EE2R Einzelheiten PDF [English] | ZSSC3170EE2R PDF - EN.pdf |
IC INTERFACE
DICE (WAFER SAWN) - WAFFLE PACK
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTERFACE
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
IC INTERFACE
WAFER (UNSAWN) - BOX
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
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![]() ZSSC3170EE2RIDT, Integrated Device Technology Inc |
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