ZSSC3136BE2R
IDT, Integrated Device Technology Inc
Deutsch
Artikelnummer: | ZSSC3136BE2R |
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Hersteller / Marke: | IDT (Renesas Electronics Corporation) |
Teil der Beschreibung.: | IC INTERFACE SPECIALIZED 14SSOP |
Datenblätte: |
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RoHs Status: | Lead free / RoHs compliant |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
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Spannungsversorgung | 4.5V ~ 5.5V |
Supplier Device-Gehäuse | 14-SSOP |
Serie | Automotive, AEC-Q100 |
Verpackung / Gehäuse | 14-SSOP (0.209", 5.30mm Width) |
Paket | Tape & Reel (TR) |
Produkteigenschaften | Eigenschaften |
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Befestigungsart | Surface Mount |
Schnittstelle | I²C, ZACwire™ One-Wire Interface |
Grundproduktnummer | ZSSC3136 |
Anwendungen | Sensor Signal Conditioner - Resistive |
ZSSC3136BE2R Einzelheiten PDF [English] | ZSSC3136BE2R PDF - EN.pdf |
IC INTERFACE SPECIALIZED 14SSOP
DICE (WAFER SAWN) - FRAME
IC INTFACE SPECIALIZED SGNL COND
IC INTERFACE SPECIALIZED 14SSOP
DICE (WAFER SAWN) - WAFFLE PACK
DICE (WAFER SAWN) - FRAME
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - FRAME
DICE (WAFER SAWN) - WAFFLE PACK
IC INTFACE SPECIALIZED SGNL COND
WAFER (UNSAWN) - BOX
IC INTERFACE SPECIALIZED 14SSOP
DICE (WAFER SAWN) - FRAME
WAFER (UNSAWN) - BOX
WAFER (UNSAWN) - BOX
DICE (WAFER SAWN) - WAFFLE PACK
IC INTFACE SPECIALIZED SGNL COND
IC INTFACE SPECIALIZED SGNL COND
DICE (WAFER SAWN) - WAFFLE PACK
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![]() ZSSC3136BE2RIDT, Integrated Device Technology Inc |
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