HSB11-252518
CUI Devices
Deutsch
Artikelnummer: | HSB11-252518 |
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Hersteller / Marke: | CUI Devices |
Teil der Beschreibung.: | HEAT SINK, BGA, 25 X 25 X 18 MM |
Datenblätte: |
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RoHs Status: | |
ECAD -Modell: | |
Zahlungsmittel: | PayPal / Credit Card / T/T |
Versandweg: | DHL / Fedex / TNT / UPS / EMS |
Aktie: |
Ship From: Hong Kong
Anzahl | Einzelpreis |
---|---|
1+ | $1.28 |
10+ | $1.213 |
25+ | $1.1808 |
50+ | $1.149 |
100+ | $1.0851 |
250+ | $1.0213 |
500+ | $0.9575 |
1000+ | $0.8937 |
5000+ | $0.8617 |
Online -RFQ -Einreichungen: Schnelle Antworten, bessere Preise!
Produkteigenschaften | Eigenschaften |
---|---|
Breite | 0.984" (25.00mm) |
Art | Top Mount |
Thermischer Widerstand @ Natürlich | 13.70°C/W |
Wärmewiderstand @ Umluft | 4.50°C/W @ 200 LFM |
Gestalten | Square, Pin Fins |
Serie | HSB |
Leistungsdissipation @ Temperaturanstieg | 5.5W @ 75°C |
Paket gekühlt | BGA |
Produkteigenschaften | Eigenschaften |
---|---|
Paket | Box |
Material Oberfläche | Black Anodized |
Stoff | Aluminum Alloy |
Länge | 0.984" (25.00mm) |
Flossenhöhe | 0.709" (18.00mm) |
Durchmesser | - |
Befestigungsmethode | Adhesive |
HEAT SINK, BGA, 10 X 10 X 7 MM
HSB119STR-E RENESAS
HEAT SINK, BGA, 14 X 14 X 6 MM
DIODE FOR SWITCHING
HEAT SINK, BGA, 20 X 20 X 9 MM
HEAT SINK, BGA, 12 X 12 X 18 MM
DIODE FOR HIGH SPEED SWITCHING
DIODE FOR HIGH SPEED SWITCHING
HSB1109S-D HSMC
HSB123TR RENESAS
HEAT SINK, BGA, 21 X 21 X 15 MM
DIODE FOR HIGH SPEED SWITCHING
HEAT SINK, BGA, 27 X 27 X 6 MM
HEAT SINK, BGA, 17 X 17 X 11.5 M
HEAT SINK, BGA, 18 X 18 X 10 MM
HEAT SINK, BGA, 23 X 23 X 6 MM
RENESAS SOT23-3
DIODE FOR HIGH SPEED SWITCHING
HEAT SINK, BGA, 17 X 17 X 6 MM
HEAT SINK, BGA, 21 X 21 X 6 MM
2024/06/6
2024/04/18
2024/04/13
2023/12/20
![]() HSB11-252518CUI Devices |
Anzahl*
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Zielpreis (USD)
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