Mfr. Part
BPC-817B
Manufacturer
BRIGHT
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Detailed Description
The BPC-817B is a specialized integrated circuit (IC) designed for hot applications. It features a compact DIP4 encapsulation.
Key Features
Specialized for hot applications
DIP4 encapsulation
Key Advantages
Reliable performance in high-temperature environments
Compact and space-saving design
Packaging
Encapsulation: DIP4
Pin configuration, thermal characteristics, and electrical properties as detailed in the datasheet
Lifecycle
The BPC-817B is an active product and not nearing discontinuation.
There are no direct equivalent or alternative models available at this time. Please contact our sales team via our website for more information.
Key Application Areas
Suitable for use in various hot or high-temperature applications
Datasheet
The most authoritative datasheet for the BPC-817B is available on our website. Customers are recommended to download it for complete product details.
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